Equipmentintroduction
This series of multi-wire cutting machines are mainly used for cutting and decomposing various hard and brittle materials such as silicon carbide, sapphire, crystal, ceramics, compounds, oxides, artificial gemstones, monocrystalline silicon, etc. into sheets. It can achieve the purpose of improving cutting accuracy, improving work efficiency, saving raw materials, and reducing the workload of the next process.
Equipment features:
Technical parameters:
|
NO |
project |
Reference data |
|
1 |
Maximum workpiece size (length, width, height) |
930mmx 130mmx 180mmx3 |
|
2 |
Slice thickness |
<35mm |
|
3 |
Roller (groove wheel) |
Medium 155mm |
|
4 |
diameter |
930mm |
|
5 |
Slotted width |
20Km (0.2 diamond line) |
|
6 |
Wire storage capacity (max) |
Medium 0.12mm-0.35mm |
|
7 |
diamond wire diameter |
1200m/min |
|
8 |
Maximum cutting trace speed |
800-1000m/min |
|
9 |
Recommended cutting and trace speed |
220mm |
|
10 |
Workbench |
0.l-999.9mm/h |
|
11 |
Power supply |
Three-phase four-wire AC380V (grounding required) 25 square 5-core cable |
|
12 |
Feed lifting stroke |
<58Kw |
|
13 |
Table cutting speed |
2630x2135x2440(mm) |
|
14 |
Power requirements: |
About 7000 kg |
|
15 |
Total power consumption |
<75KW |
|
16 |
Machine Specification Dimensions (LxWxH) |
3200x2500x2600(mm) |
|
17 |
weight |
<9000kg |
|
18 |
Note: |
The above parameters can be redesigned and reorganized according to actual needs. |